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Assembly Plus, LLC

    Electronics Contract Manufacturer
    Phoenix Arizona


   Iso 9001:2008   Certified/Registered

Assembly Plus Capabilities

. Turn Key and Consigned Assembly
. Thru Hole, Surface Mount, Mixed Technology, Fine Pitch, BGA
. RoHS, NON RoHS
. IPC-A-610D Class 2, Class 3
. Conformal Coating, Wave Solder, Aqueous Cleaner
. Full Box Build, Mechanical Assembly, General Electro Mechanical Assembly
. Test

Serving the Electronics Community

Aerospace, Robotics, Medical, Defense, Industrial Electronics, Communications, Commercial, and others.

Geographical Areas Serviced

Arizona, California, Nevada, New Mexico, Utah, (South West USA)
Customers Nationwide, Canada, Europe, (International)


Major Equipment

. Two fully automated High speed surface mount lines with multi zone re-flow ovens.
. Separate RoHS & Non RoHS wave solder lines.
. CFC-free, closed loop Aqueous cleaning system.
. BGA X-Ray machine.